RTD Embedded Technologies
RTD Embedded Technologies develops modular, stackable embedded-computer boards and rugged systems in PC/104, PCIe/104, and PCI/104-Express standards. Its portfolio spans CPU boards and NVIDIA GPU carriers, high-speed data acquisition, networking, power, and storage modules, plus IDAN and HiDANplus enclosure options. TARGET A.Ş. is the local technical point of contact in Türkiye for module selection, stack architecture, and system integration.
Modular mission computing with PC/104 CPU boards and NVIDIA Jetson modules.
Synchronized acquisition modules that add analog, digital, and communication I/O to the stack.
Systems completed with M.2 storage, networking, power, and environmental-enclosure layers.
Three modular layers from compute to data, within one stack.
Compute workload, data rate, I/O count, storage, expansion bus, and environmental-packaging requirements are evaluated together.
NVIDIA Jetson AGX Orin PC/104
A rugged computing board that brings Jetson AGX Orin into a modular PC/104 architecture with PCIe/104 expansion, M.2 slots, and rich I/O.
- 32 GB, 64 GB, and Industrial module options
- PCIe/104 Type 2 and M.2 expansion
- Camera, network, USB, serial, and CAN interfaces
DM34216HR high-speed DAQ
A rugged PCIe/104 data-acquisition module with four independent ADCs for simultaneous sampling and continuous data transfer.
- Four-channel 16-bit simultaneous sampling
- 1–25 MSPS sampling per channel
- SyncBus, DMA, digital I/O, and PWM
SSD24/34 M.2 carriers
A family of single- and dual-Socket 3 carriers that adds SATA- or PCIe-connected M.2 storage to a CPU in the stack.
- One or two M.2 M-key sockets
- SATA and NVMe device support
- PCIe/104 and PCI/104-Express variants
Solution architecture
From compute board to an environmentally packaged stack.
RTD’s modular approach combines compute, I/O, storage, and communication layers through stackable PC/104 buses.
01 / COMPUTE
Select the CPU or GPU target
Choose the main board according to workload, AI requirements, operating system, memory, and power budget.
02 / I/O
Add data and control layers
Place analog and digital I/O, communications, networking, timing, and acquisition modules in the stack.
03 / DATA
Match storage and connectivity
Select NVMe or SATA storage, Ethernet, and other peripherals according to bandwidth needs.
04 / PACKAGE
Verify enclosure and interfaces
Validate IDAN, HiDAN, or HiDANplus options against connector, sealing, thermal, and mechanical requirements.
Why RTD?
RTD combines small-form-factor boards in a modular system approach that scales from compute and I/O to environmental enclosures.
Stackable COTS architecture
CPU, GPU, I/O, storage, and networking modules form a compact and expandable stack through PC/104 buses.
From board to rugged system
The same modules can be configured in IDAN enclosures with standard connectivity or sealed HiDANplus enclosures with locking connectors.
Integrity for data-intensive applications
High-speed DAQ, GPU compute, and NVMe storage can be combined in one architecture after bandwidth and compatibility are verified.
PC/104, PCIe/104, and rugged embedded-computer solutions
RTD Embedded Technologies offers PC/104-based CPU and NVIDIA GPU modules, analog and digital I/O boards, high-speed data acquisition, networking, power, and M.2 storage solutions.
Modular boards can be combined in a stack architecture by evaluating processing performance, bus type, I/O count, data rate, storage capacity, and power budget together, then packaged at system level with IDAN and HiDANplus options.
RTD system selection and integration support in Türkiye
TARGET A.Ş. provides local technical support in Türkiye for RTD Embedded Technologies CPU/GPU board, I/O and storage-module selection, PC/104 stack planning, mechanical packaging, and system interfaces. Module compatibility and environmental values are verified against the current technical documentation for the selected parts.
